cystech electronics corp. spec. no. : c335sh issued date : 2011.05.10 revised date : 2012.06.28 page no. : 1/5 bas21h cystek product specification fast switching diodes BAS21SH features ? fast switching speed ? low forward voltage drop ? pb-free lead plating package mechanical data ? case: molded plastic, jedec sod-123. ? terminals: pure tin plated, solderable per mil-std-202 method 208 ? polarity: indicated by cathode band. ? weight: 0.01 gram approximately maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified. ) parameter symbol type units non-repetitive peak reverse voltage v rm 250 repetitive peak reverse voltage v rrm 250 working peak reverse voltage v rwm 250 rms voltage v rms 141 dc blocking voltage v r 250 v forward continuous current i fm 400 average rectified output current i o 200 ma 2.5 peak forward surge current @ t=1ms t=1s i fsm 0.5 a repetitive peak forward current i frm 625 ma power dissipation p d 500 mw thermal resistance, junction to ambient r ja 250 /w operating and storage temperature range t j ;t stg -65 ~ +150 ordering information device package shipping marking BAS21SH sod-123 (pb-free lead plating package) 3000 pcs / tape & reel t3 sod-123
cystech electronics corp. spec. no. : c335sh issued date : 2011.05.10 revised date : 2012.06.28 page no. : 2/5 bas21h cystek product specification electrical characteristics @ t a =25 unless otherwise specified parameters symbol conditions min typ. max unit forward voltage v f i f =100ma i f =200ma - - 1 1.25 v reverse current i r v r =200v - - 100 na junction capacitance c j v r =0v, f=1mhz - - 5 pf reverse recovery time trr i f =i r =30ma, irr=0.1 i r , r l =100 - - 50 ns typical characteristics forward current vs forward voltage 0.1 1 10 100 1000 0 0.3 0.6 0.9 1.2 1.5 forward voltage---vf(v) instantaneous forward current---if(ma) pulse width=300s 25c 75c 100c 125c 150c reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 0 50 100 150 200 250 reverse voltage---vr(v) reverse leakage current---ir(a) 100 75 25 125 150c junction capacitance vs reverse voltage 0.1 1 10 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz power derating curve 0 100 200 300 400 500 600 0 25 50 75 100 125 150 175 t a , ambient temperature() p d , power dissipation(mw)
cystech electronics corp. spec. no. : c335sh issued date : 2011.05.10 revised date : 2012.06.28 page no. : 3/5 bas21h cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c335sh issued date : 2011.05.10 revised date : 2012.06.28 page no. : 4/5 bas21h cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c335sh issued date : 2011.05.10 revised date : 2012.06.28 page no. : 5/5 bas21h cystek product specification sod-123 dimension marking: t3 2-lead sod-123 plastic surface mounted package cystek package code: sh style: pin 1.cathode 2.anode inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.102 0.110 2.600 2.800 d 0.018 0.026 0.450 0.650 b 0.059 0.067 1.500 1.700 e 0.140 0.152 3.550 3.850 c 0.041 0.049 1.050 1.250 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with pa cking specification or packing me thod, please contact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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